Products
EMC-200 Mold Cleaner Serise
1, Introduction
The use of a certain number of plastic mold can cause mold surface after a certain degree of contamination, if the continued use of plastic semiconductor materials will lead to decreased surface finish, seriously damaging the quality of the product's appearance. Mold cleaner to remove tape residue on the mold in the dirt.
The company's latest R & D production of Mold cleaner requirements applicable to a variety of different plastic molds, their dimensions and packing weight can be manufactured according to the user's requirements. This product is superior effect of the Qing mode, all performance indicators have reached international advanced level.
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2, Physical property
Item |
Unit |
Details |
Appearance |
|
White cylinder |
Size |
mm |
Ф40×50, 55, 60; Ф50×60, 70, 80, 90; Ф57×80, 90, 100, 120 |
Specific weight |
g/cm3 |
1.5-1.7 |
Helicoidal flow lenghth |
cm |
80-120 |
pH |
|
7-7.5 |
Weight |
KG/box |
10(provide different packaging) |
3, Mold-cleaning conditions
Preheating time(S) |
Moulding temp.(°C) |
Moulding pressure |
Mould-pressing time (min) |
Cleaning times |
30-40 |
165-170 |
7 |
5-7 |
|
30-40 |
170-175 |
7 |
5-7 |
|
30-40 |
175-180 |
6 |
5-7 |
|
30-40 |
180 up |
5 |
5-7 |
Note: No cooling is necessary for mould-cleaning in capsulation temperature