Products

 

EMCP Mold Clean Powder

 

1, Introduction

The use of a certain number of plastic mold can cause mold surface after a certain degree of contamination, if the continued use of plastic semiconductor materials will lead to decreased surface finish, seriously damaging the quality of the product's appearance.  EMCP mold powder effective way to remove mold powder residue on the mold in the dirt.

The company's latest R & D model of the EMCP clear powder applied to a variety of different requirements of the plastic mold, the weight of its packaging can be manufactured according to the user's requirements.  This product is superior effect of the mode, all performance indicators have reached international advanced level.

2, Packing and storage

1) Packing: EMCP mold clean powder is firstly sealed in a polyethylene bag, and then packed in cardboard box; Net wt is 10kg.
2) Storage: (1) storage temp.: 5°C or less; If kept in room temperature, 21 days since it leaves refrigeratory, the rests should be sent back to refrigeratory; (2) Shelf period: In 5°C or less, 12 months since manufacturing date.
3) transportation: Avoid moisture, heat, insolation and rain.

3, Physical property

Item	Unit	EMCP
Appearance		White powder
Odor		Odorless
Specific gravity	g/cm3	0.45-0.55
Weight	KG/box	10

4, Mold-cleaning conditions

Type	Moulding temp.(°C)	Moulding pressure	Mould-pressing time (min)	Cleaning times
EMCP mold clean powder	170-190	30-40	5-7	3-6

This product can be under the same conditions with the epoxy molding use, but in order to achieve better results, it should be noted in different types of devices using different filling conditions and temperature.